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![Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-Micron Pitch On EV Group System Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-Micron Pitch On EV Group System](https://www.evgroup.com/fileadmin/_processed_/5/7/csm_2017_11_Leti_GEMINI_FB_XT_c26297cf53.jpg)